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using automated methods
This Document is a guideline for the ordering of tooling required to mold and form plastic chip carriers
SEMI E125-0304 (technical revision)
procedures and notations for data acquisition and modeling exist
The second procedure is a comparison with a linearly polarized light source with known CL
G00200 - SEMI G2 - Specification for Metallic Leadframes for CerDIP Packages Revision:SEMI G2-94 - Inactive using automated methodsNOTICE: This Standard or Safety Guideline has an Inactive Status because the conditions to maintain Current Status have not been met. Inactive Standards or Safety Guidelines are available from SEMI and continue to be valid for use. This Specification defines the materials and dimensions for the metallic leadframe (stamped or etched) used in the construction of CerDIP Package. The criteria detailed in this Document applies to the iron nickel leadframe
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